[江蘇西安]瀾起電子科技有限公司
- 發布時間:2020-09-15
- 工作地點:其它
- 職位類型:全職
- 來源:北京郵電大學
- 職位:2021校園招聘
- 發布時間: 2020-09-15
職位 | 學歷 | 學院 | 專業 | 需求人數 |
---|---|---|---|---|
Analog Design Engineer 模擬設計工程師 | ||||
Design Verification Engineer 設計驗證工程師 | ||||
Software Development Engineer 軟件開發工程師 |
Analog Design Engineer 模擬設計工程師
-設計,驗證和測試模擬/混合信號電路;
-指導版圖工程師完成電路的版圖設計。
-Design, evaluate and verify analog/mixed circuits;
-Work closely with layout engineer for layout implementation.
Digital Design Engineer 數字設計工程師
-頂層或模塊電路的RTL代碼實現;
-IP模塊綜合/時序分析/形式驗證/跨時鐘域檢查/代碼覆蓋率檢查。
-Write RTL coding for block or top level;
-Do IP level synthesis / timing analysis / formality check / CDC check /Code coverage check.
Design Verification Engineer 設計驗證工程師
-和設計人員一起制定驗證計劃;
-制定驗證框架和開發驗證環境;
-能夠按照計劃,保質保量完成驗證工作。
-Create verification plans with designers;
-Develop DV architecture and verification environment;
-Verification execution and sign-off.
Software Development Engineer 軟件開發工程師
-安全或AI相關的固件、驅動或系統庫開發工作;
-開發和維護單元測試;
-定位、調試錯誤并維護開發中的代碼;
-算法設計和開發文檔的維護工作。
- Firmware, driver and library development for Security or AI software;
- Unit test development and maintain;
- Troubleshoot, debug and maintain existing software;
- Algorithms design and document maintain.
Software Validation Engineer 軟件驗證工程師
-開發,維護和改進自動化測試框架;
-為安全或AI相關的固件、驅動等軟件代碼設計測試計劃;
-開發測試用例和進行日常測試;
-維護軟件和文檔的版本;
-和開發工程師共同分析和調試潛在的代碼錯誤。
-Develop, maintain and improve the automatic test framework;
- Make test plan for Security or AI FW and driver code;
- Develop test case and daily test;
- Maintain version of code and document;
- Co-work with developer to analysis potential bug.
Test Engineer測試工程師
-進行板級芯片/系統功能驗證和性能測試;
-在服務器/測試平臺上開發芯片測試接口的自動測試代碼;
-分析產品缺陷及客戶退貨失效分析。
-Work on board level chip/system function verification and performance test;
-Develop and merge the auto-test for chip test interface in server/bench;
-Analyze bug of our product and failure of customer return.
Software Engineer 軟件工程師
-Linux驅動開發;
-芯片的軟件應用開發;
-芯片/系統測試及驗證的工具開發。
-Linux driver development;
- Software application for chip;
-Toolkit development for chip/system test/validation.
Test Development Engineer 測試開發工程師
-在半導體自動測試設備上完成硬件和軟件開發,以支持公司集成電路產品的研發和規模生產
-支持研發部門完成新產品評估和驗證,確保產品功能,電流,電壓及電路時序等參數符合產品設計和規格要求。
-Develop ATE test hardware software to support IC design and production;
-Support DE/AE to fulfill device evaluation for new product on functional patterns and DC/AC parameters to guarantee the parameters meet design target or datasheet spec.
Product Engineer 產品工程師
支持產品認證工作(包括特性測試/關聯性測試/靜電測試/閂鎖測試/壽命測試/邊緣測等),維護并提升晶元片和封裝后測試的生產良率和產品質量。
-Support product qualification (Characterization/Correlation/ESD/LU/LifeTest/CornerLot, etc) and maintain /enhance test yield and quality of devices in final test(FT) as well as wafer sort(CP).
Packaging Engineer 封裝工程師
-評估芯片封裝的可行性,為產品設計提供有競爭力的封裝方案. 從封裝設計的角度優化die pad以及ball map;
-能夠獨立完成芯片封裝設計;協同封裝廠與基板廠審核設計方案.;生成封裝設計仿真模型。
-Package design feasibility study to provide the more competitive package solution; Co-work with R&D team to optimize and generate the Bump map and Ball map;
-Responsible for completing package designs; review the design files with subcon and substrate vendor; generate the package simulation model.
Foundry Process Engineer 晶圓工藝工程師
-跟蹤人工智能與大數據相關新興技術,包括磁阻式隨機存取存儲器/阻變存儲器等;
-在產品開發階段支持設計實現,包括解決電路仿真、器件使用、可靠性、版圖、設計定案等方面的問題;
-與晶圓廠及內部團隊合作,處理產品良率與可靠性相關問題并持續改進。
-Work with both fab and internal teams to handle product yield& reliability issues and strive for continuous improvement;
-Support design enables in product development phase, including problem solving for circuitry simulation, device operation, reliability assurance, layout, tape out, etc.;
-Track emerging technologies, like MRAM/RRAM, for AI and big data applications.
Failure Analysis Engineer 失效分析工程師
-使用實驗室的設備/平臺,必要的時候自己搭建所需的測試平臺,對失效產品的特定的電路進行電性能的分析;
-與物理失效分析工程師或者第三方失效分析實驗室合作,采用合適的失效分析手段,對失效產品做針對性的破壞性分析,找到產品失效/缺陷的物理證據。
-Electrical level analysis on failed device, using the equipments/test bench available in lab, or setup necessary test bench by yourself to do the test on specific circuit block;
-Co-work with physical FA engineer and 3rd party FA lab, using related physical FA method to do the destructive FA on failed device, and find the physical defect/damage point on the device.
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